SMT-ServiCE
SMT-ServiCE is a Unique Digital PID Control SMT
Rework/Repair Unit with integrated Pre-heater,
which offers precise and accurate monitoring of
process temperatures at a working point on a PCB. Also,
allows pre-setting of exact temperature of air stream
at the end of Hot Air Pencil Nozzle and at a tip of
Soldering Iron. The accuracy is achieved by a unique
feature, user-adjustable offset, which compensates for
differences in PCBs' being reworked (dual or
multi-layer, high and low mass) in case of pre-heater
settings. The off-set for soldering iron tip and hot
air stream temperature settings allows for accurate
compensation when changing tips or nozzles.
The unique,
high performance of the unit is possible due to use of
the newest microprocessor technology and thorough
programming of all control and monitoring functions
combined with PID temperature control of all heaters.
 |
 |
| XHP-10 | XVP-10 |
 |
 |
 |
| XST-77 | AS-3B | AML-301A |
 |
Unique offset feature, which allows precise setting of PCB temperature Note: Precise temperature setting on PCB is also a function of preheat time. Offset is set experimentally for a defined preheat time e.g. 2 min, 3 min etc. |
The SMT-ServiCE was primarily designed for SMT
Rework and Repair of the printed circuit board
assemblies using SMT components. The emphasis of the
design was on observation of appropriate process
control required for correct Rework and Repair.
This includes protection of the boards (and the vias
inside them) against sudden thermal shock to prevent
difficult to detect damages as well as components
themselves, which are already connected to the board.
Bottom convection pre-heat of the large area of the
board guarantees even and gradual thermal expansion.
Pre-heated board to e.g. 130 degrees C, needs much
less thermal energy to de-solder or re-solder a
component on the board. To de-solder the component
only 53 degrees C are needed (183 deg., which is
melting temperature of the solder minus 130 deg. which
the board is pre-heated to by the bottom pre-heater).
To achieve this relatively low temperature
differential, lower thermal capacity and lower air
temperature tool can be used, which guarantees safer
for the board and the components rework process. This
lower temperature differential required to obtain
solder melting point makes the rework process much
faster than the one, which is done when using
conventional rework tools.
For your convenience and to save the valuable bench
space the system includes in one Base a Pre-heater, a
Hot air Tool and a Vacuum Pick up Pencil, giving you
all what you need to Rework or Repair most of the SMT
Technology Boards. Standard board holder XU-1S allows
you to mount 12" (305mm) wide x not limited in
length boards. Other, optional board holders are
available to accommodate boards up to 21.5" wide.
Available models are: XU-5, XU-Mini, XCBH-1, XU-1,
XU-2 and XU-3.
The powerful Pre-heater will also allow you to rework
high mass boards, which have through-hole components
like connectors etc. (you must use proper pre-heat
temperature, which is lower than the maximum allowable
value for the plastic from which your connectors are
made).
Both Pre-heater and Hot air Tool have close loop
temperature control and maintain the setting
temperatures with high accuracy. The Vacuum pick up
tool uses the top of the line vacuum pump to give
reliable and consistent operation by maintaining high
vacuum at wide range of supply voltage and frequency
fluctuations.
The system can accommodate optional tool stand with
adjustable Z-Axis control (if this is your preference
for 4 sided components rework). The stand holds an XHT
Series Hot Air Tool in a vertical position for precise
component removal and installation operations. The hot
air tool is held vertically to the work platform of a
base and bottom edges of any nozzle mounted on the
tool are horizontal to a PCB, which is in a board
holder placed on the work platform.
The System also accommodates Semi Automatic Vacuum
Component Pick-up Option XCP-01 which attaches to the
System for automatic component lift upon reflow of the
solder.
| Overall System: | |
|---|---|
| Input Voltages | 110-120, 220-240V AC |
| Power Consumption | Max. 1200VA |
| Weight | 5.5 kg (12 Ibs.) |
| System dimensions | 487x328x88mm 19.1" x 12.9" x 3.5" |
| Packaged weight | 11.3 kg (25 lbs) |
| Pre-heater Section: | |
| Max. Power | 1050 VA |
| Preheat Temperature measured on a PCB | 140-302 °F (60 -150 °C) |
| Preheat area | More than 8" square |
| Average PCB preheat time to 150 deg C |
Less than 2 min. |
| Hot Air Pencil: | |
| Input Voltage | 24V AC |
| Power Consumption | 80 VA |
| Temperature Range | 392 - 878 °F (200 - 470 °C) |
| Air Source | High efficiency diaphragm pump |
| Air Flow | .5 - 4.5 l/min |
| Hand piece weight | 50g (.11 Ibs.) w/o cord |
| Air Nozzles Kit | 3 standard nozzles (XN-2, XN-3 and XN-6) |
| Hot Air Iron: | |
| Input Voltage | 24V AC |
| Power Consumption | 60 VA |
| Temperature Range | 347 - 788 °F (175 - 420 °C) |
| Hand piece weight | 50g (.11 Ibs.) w/o cord |
| Vacuum Pick-Up: | |
| Vacuum source | High efficiency diaphragm pump |
| Vacuum | 8" Hg (200mmHg) |
| Hand piece | Slim, Light weight and ESD safe |
| Vacuum Probe Kit | 3 probes and 3 ESD cups |
| "K" TC Range | 77-1112 °F (25-600 °C) |
 |
 |
 |
| XN-1 | XN-2 | XN-3 |
 |
 |
 |
| XN-4 | XN-5 | XN-6 |
 |
 |
 |
| XN-7 | XN-8 | XN-9 |
| Nozzles contain in XHP-NS1 Nozzle Set |
|
 |