X-MicroPrint - Single Component printing SystemPatent pending (US & Europe)
The System was designed to allow precision printing flux on the land pattern of an SMD Component.
Like no other system known to date, X-MicroPrint System includes precise X-Y adjustment and theta rotation. It includes spring-loaded and self-leveling mechanism, which assures good, parallel positioning of the stencil to the land pattern on a PCB. Foot switch activating vertical snap-off mechanism assures stencil removal after printing without any sideways motion, which could smear the paste or flux.
System includes:
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Optional accessories and spares:
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XmP-1 |
XMS-1 Micro Squeegee set |
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Custom stencils are available upon request. Please supply IC and pattern with dimensions to get a quote. Standard Stencils: (Please note that matching micro-squeegee is supplied with each stencil) |
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| Part Number |
Description | Stencil Footprint size | Component pitch | Aperture Size | Stencil thickness | Metal Squeegee Blades | |
| Width x Depth (mm) | (mm/inches) | (inches) | (mm/inches) | Width | Thickness | ||
| XSCS-100 | BGA 169 1.5mm pitch | 24x24 | 1.27 / 0.060" | 0.030 dia. | 0.15 / 0.006 | 0.880 | 0.012 |
| XSCS-101 | BGA 225 1.5mm pitch | 27x27 | 1.50 / 0.060" | 0.030 dia. | 0.15 / 0.006 | 1.000 | 0.012 |
| XSCS-300 | PLCC 44 | 22x22 | 1.27 / 0.050" | 0.023 x 0.073 | 0.2 / 0.008" | 0.800 | 0.012 |
| XSCS-301 | PLCC 68 | 30x30 | 1.27 / 0.050" | 0.025 x 0.100 | 0.2 / 0.008" | 1.120 | 0.012 |
| XSCS-302 | PLCC 84 | 37x37 | 1.27 / 0.050" | 0.025 x 0.098 | 0.2 / 0.008" | 1.320 | 0.02 |
| XSCS-200 | BQFP 100 | 29x29 | 0.635 / .025" | 0.013 x 0.088 | 0.15 / 0.006" | 1.080 | 0.012 |
| XSCS-201 | QFP-100 | 30x24 | 0.65 / 0.025" | 0.013 x 0.075 | 0.15 / 0.006" | 0.880 | 0.012 |
| XSCS-202 | QFP-208 | 36x36 | 0.5 / 0.020" | 0.010 x 0.060 | 0.15 / 0.006" | 1.370 | 0.02 |