X-BGA-DP - Dipping Plate System Set
X-BGA-DP includes:
- Dipping Plate System
Two plates:
- X-BGA-DP-18x18x0.15 - Size: 18 x 18 mm, depth: 0.15 mm
- X-BGA-DP-20x20x0.25 - Size: 20 x 20 mm, depth: 0.25 mm
- Micro Squeegee
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This set facilitates application of paste flux (or paste) onto the
balls under the BGA packages. The plates can be ordered to accommodate
different component sizes and ball diameters.
How to use the dipping system:
- Apply paste flux into the selected plate (choose size and depth
corresponding to your BGA package).
- Even the flux with the top edge of the dipping plate.
- Place the component into the dipping system. Apply light pressure to
make sure that the BGA balls reached the bottom of the system.
- Lift the BGA ( using either vacuum system or tweezers ).
- The flux paste will be applied evenly (quantity depends on the depth
of the plate) to each ball.
Other available plates:
| Part Number |
Size |
Depth |
| X-BGA-DP-15x15x0.15 |
12,5x12,5 mm |
0.15 mm |
| X-BGA-DP-18x18x0.15 |
18x18 mm |
0.15 mm |
| X-BGA-DP-25x25x0.15 |
25x25 mm |
0.15 mm |
| X-BGA-DP-15x15x0.25 |
15x15 mm |
0.25 mm |
| X-BGA-DP-20x20x0.25 |
20x20 mm |
0.25 mm |
| X-BGA-DP-30x30x0.25 |
30x30 mm |
0.25 mm |
| X-BGA-DP-20x20x0.40 |
20x20 mm |
0.40 mm |
| X-BGA-DP-30x30x0.40 |
30x30 mm |
0.40 mm |
