11 X-Reflow306 LF Full Convection, Bench Top, Batch oven with Nitrogen Connections

X-Reflow306 LF Full Convection,
Bench Top, Batch oven with Nitrogen Connections

Especially designed for LEAD FREE Soldering

CE Mark X-REFLOW306 LF
Lead Free

Technical Specifications

  X-Reflow306 LF and X-Reflow306 LF-AC
Reflow area 12"x12"x1.75" (305x305x45 mm)
Temperature range 70°C to 350°C
Temperature Zones Preheat1, Preheat2, Soak, Reflow, Cooling – Total of 5 (five) zones
Heaters 2 Heaters (Front and Rear) 3,45kW (230V) and 3,45KW (280V) - Please specify voltage to receive correct heaters. Programmed independently
Max. PCB size 12"x12" (305x305 mm)
Supply Requirements 30 amps, 230V 50/60 Hz (Max power consumption: 6.9 kW)
Cooling Cycle Last (Fifth) Zone
Monitoring Window Size 9.84"x9.84" (280×280 mm)
Nitrogen Connection Standard Connector. Nitrogen pressure:1/2-1bar (7-14.5 psi)
Size L=30"xW=20"xH=12" (L=480mm x W=711mm x H=200mm)
Weight (unpacked) 88 lbs. (40 kg)
Computer profile control Allows pre-programming, storage and recall of up to 250 programs
Communication with PC RS485 port (XKAR X485-USB converter required to connect to PC USB port)
Advanced Features Display of the actual temperature/time numerically or as a graph,
Independent off-set for the heaters,
RS-485 port for downloading firmware upgrades from a PC,
Ready to solder in Nitrogen environment,
Variety of ways to monitor process in progress.
Manufacturer is committed to continuing development of new products and improvements to existing products.
Specifications are subject to change without notice.