11 XURB Universal Re-balling Unit
XURB Universal Re-balling Unit

XURB Universal Re-balling Unit

  Standard XURB-S System includes:
  Description:

The XURB-S set has is an independent heating system, a Hot Plate XURB-H matching the re-balling fixture.

This heating method allows for reflow of re-balled IC in approximately 2 min., which is 2 to 3 times faster and better than on any other heating system.

Specifically designed for XURB, the XURB-H unit has temperature controller with closed loop feedback, which guarantees proper heating rate and maximum temperature limit preventing re-balled component damage.

It also includes cooling fan, like no other unit in the industry to speed-up re-balling time and make better quality solder balls.

  XURB-S Re-balling Stencil and XURB-I Insert
P/N Stencil/Insert set
Component Information		 P/N Stencil
Component pattern		 P/N Insert
XURB-S/I-156-1-15-1.2

Component Information
BGA156;
I/O Count 156;
Pitch 1.0mm;
Body Size 15mm;
Plastic Height 1.2mm

 XURB-S-156-1-15
BGA156
A = 1.0 mm; B = 15 mm; C = 1.2 mm		 XURB-I-15-1.2

X = 15 mm; Y = 15 mm; Z = 1.2 mm
XURB-S/I-456-1-23-1.6

Component Information
BGA456;
I/O Count 456;
Pitch 1.0mm;
Body Size 23mm;
Plastic Height 1.6mm

 XURB-S-456-1-23
BGA456
A = 1.0 mm; B = 23 mm; C = 1.6 mm 		XURB-I-23-1.6

X = 23 mm; Y = 23 mm; Z = 1.6 mm
XURB-S/I-324-1.27-27-1.6

Component Information
BGA324;
I/O Count 324;
Pitch 1.27mm;
Body Size 27mm;
Plastic Height 1.6mm

 XURB-S-324-1.27-27
BGA324
A = 1.27 mm; B = 27 mm; C = 1.6 mm 		XURB-I-27-1.6

X = 27 mm; Y = 27 mm; Z = 1.6 mm
XURB-S/I-352-1.27-27-1.6

Component Information
BGA352;
I/O Count 352;
Pitch 1.27mm;
Body Size 27mm,
Plastic Height 1.6mm

 XURB-S-352-1.27-27
BGA352
A = 1.27 mm; B = 27 mm; C = 1.6 mm 		XURB-I-27-1.6

X = 27 mm; Y = 27 mm; Z = 1.6 mm
XURB-S/I-696-1-31-1.8

Component Information
BGA696;
I/O Count 696;
Pitch 1mm;
Body Size 31mm;
Plastic Height 1.8m

 XURB-S-696-1-31
BGA696
A = 1 mm; B = 31 mm; C = 1.8 mm 		XURB-I-31-1.8

X = 31 mm; Y = 31 mm; Z = 1.8 mm
XURB-S/I-388-1.27-35-1.8

Component Information
BGA388;
I/O Count 388;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-388-1.27-35
BGA388
A = 1.27 mm; B = 35 mm; C = 1.8 mm 		XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-456-1.27-35-1.8

Component Information
BGA456;
I/O Count 456;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-456-1.27-35
BGA456
A = 1.27 mm; B = 35 mm; C = 1.8 mm 		XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-492-1.27-35-1.8

Component Information
BGA492;
I/O Count 492;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-492-1.27-35
BGA492
A = 1.27 mm; B = 35 mm; C = 1.8 mm 		XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-596-1.27-35-1.8

Component Information
BGA596;
I/O Count 596;
Pitch 1.27mm;
Body Size 35mm;
Plastic Height 1.8m

 XURB-S-596-1.27-35
BGA596
A = 1.27 mm; B = 35 mm; C = 1.8 mm 		XURB-I-35-1.8

X = 35 mm; Y = 35 mm; Z = 1.8 mm
XURB-S/I-676-1.27-37.5-1.8

Component Information
BGA676;
I/O Count 676;
Pitch 1.27mm;
Body Size 37.5mm;
Plastic Height 1.8m

 XURB-S-676-1.27-37.5
BGA676
A = 1.27 mm; B = 37.5 mm; C = 1.8 mm 		XURB-I-37.-1.8

X = 37.5mm; Y = 37.5mm; Z = 1.8mm
XURB-S/I-432-1.27-40-1.6

Component Information
BGA432;
I/O Count 432;
Pitch 1.27mm;
Body Size 40mm;
Plastic Height 1.6m

 XURB-S-432-1.27-40
BGA432
A = 1.27 mm; B = 40 mm; C = 1.6 mm 		XURB-I-40-1.6

X = 40 mm; Y = 40 mm; Z = 1.6 mm
XURB-S/I-69-0.8-11x8-1

Component Information
BGA69;
I/O Count 69;
Pitch 0.8mm;
Body Size 11x8mm;
Plastic Height 1mm

 XURB-S-69-0.8-11x8

A = 0.8 mm; B1 = 11 mm;
B2 = 8 mm; C = 1.6 mm 		XURB-I-11x8-1
XURB-S/I-208-0.8-15-1.2

Component Information
BGA208;
I/O Count 208;
Pitch 0.8mm;
Body Size 15mm;
Plastic Height 1.2mm

 XURB-S-208-0.8-15

A = 0.8 mm; B = 15 mm; C = 1.2 mm 		XURB-I-15-1.2

X = 15 mm; Y = 15 mm; Z = 1.2 mm
  XURB-I – Insert specific for an IC body size.
P/N Stencil P/N match to Insert
XURB-I-15-1.2 XURB-S-156-1-15
XURB-I-23-1.6 XURB-S-456-1-23
XURB-I-27-1.6 XURB-S-324-1.27-27
XURB-S-352-1.27-27
XURB-I-31-1.8 XURB-S-696-1-31
XURB-I-35-1.8 XURB-S-388-1.27-35
XURB-S-456-1.27-35
XURB-S-492-1.27-35
XURB-S-596-1.27-35
XURB-I-37.5-1.8 XURB-S-676-1.27-37.5
XURB-I-40-1.6 XURB-S-432-1.27-40
Solder Balls
Part Number Description Qty in container
  Alloy Sn62/Pb36/Ag2  
XSB-0.3-10 Ball Diameter 0.3mm, (0,012")  Small Containers 10 000 pcs
XSB-0.3-25 Ball Diameter 0.3mm, (0,012")  Small Containers 25 000 pcs
XSB-0.3-50 Ball Diameter 0.3mm, (0,012")  Small Containers 50 000 pcs
XSB-0.45-10 Ball Diameter 0.45mm,(0,018")  Small Containers 10 000 pcs
XSB-0.45-25 Ball Diameter 0.45mm,(0,018")  Small Containers 25 000 pcs
XSB-0.45-50 Ball Diameter 0.45mm,(0,018")  Small Containers 50 000 pcs
XSB-0.5-10 Ball Diameter 0.5mm,  (0.020")  Small Containers 10 000 pcs
XSB-0.5-25 Ball Diameter 0.5mm,  (0.020")  Small Containers 25 000 pcs
XSB-0.5-50 Ball Diameter 0.5mm,  (0.020")  Small Containers 50 000 pcs
XSB-0.63-10 Ball Diameter 0.63mm, (0,0252")  Small Containers 10 000 pcs
XSB-0.63-25 Ball Diameter 0.63mm, (0,0252")  Small Containers 25 000 pcs
XSB-0.63-50 Ball Diameter 0.63mm, (0,0252")  Small Containers 50 000 pcs
XSB-0.76-10 Ball Diameter 0.76mm, (0,0304")  Small Containers 10 000 pcs
XSB-0.76-25 BallDiameter 0.76mm, (0,0304")  Small Containers 25 000 pcs
XSB-0.76-50 Ball Diameter 0.76mm, (0,0304")  Small Containers 50 000 pcs
Lead Free Alloy Sn 96,5% - Ag-3% - Cu-0,5%
XSB-0.3LF-10 Ball Diameter 0.3mm, (0,012")  Small Containers 10 000 pcs
XSB-0.3LF-25 Ball Diameter 0.3mm, (0,012")  Small Containers 25 000 pcs
XSB-0.3LF-50 Ball Diameter 0.3mm, (0,012")  Small Containers 50 000 pcs
XSB-0.45LF-10 Ball Diameter 0.45mm,(0,018")  Small Containers 10 000 pcs
XSB-0.45LF-25 Ball Diameter 0.45mm,(0,018")  Small Containers 25 000 pcs
XSB-0.45LF-50 Ball Diameter 0.45mm,(0,018")  Small Containers 50 000 pcs
XSB-0.5LF-10 Ball Diameter 0.5mm,  (0.020")  Small Containers 10 000 pcs
XSB-0.5LF-25 Ball Diameter 0.5mm,  (0.020")  Small Containers 25 000 pcs
XSB-0.5LF-50 Ball Diameter 0.5mm,  (0.020")  Small Containers 50 000 pcs
How to use the Re-balling Set
  1. Before Beginning to reball you component you must first remove the old solder balls and solder residual. It is recommended that you use XS-StencilCleaner each time you perform the reballing process. this will extend the life of your stencil and improve the reballing process.
  2. Place the XURB Insert into the Reballing frame.
  1. Place the component to be reworked in the insert with the surface to be reballed face up.

  1. Use the Micro Squeegee to apply flux evenly to the IC body.
  1. Place the appropriate re-balling stencil over the IC ensuring that it aligns with the positioning pins on the insert.

  1. Place the stencil holding frame on the top of the stencil and tighten the knob.

  1. Distribute the balls across the stencil using tweezers or a brush if needed until each opening contains one ball.
  2. Excess balls should be poured carefully back into the container through a large opening in the top corner.
  3. To Reflow:
    There are several choices how the balls can be reflow:
    1. Use X-KAR XURB, Independent Re-balling Heating Unit, which offers the fastest, and the most efficient reflow
    2. Place the Base Unit with component, stencil, and the frame in the oven and start reflow cycle.
    3. Use any of X-KAR Pre-heater units to reflow the balls.
  4. Remove reballing set from the oven or cool down the X-KAR Preheater to allow the package to cool.
  5. Remove the frame, reballing stencil, and the component.
  6. Inspect the quality of reballing.
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